T5 Pro-Grade+Easily apply ultra-performance hybrid thermal paste to your CPU and GPU, designed for highly efficient computer setups. Perfect for overclocking enthusiasts with 10-20 applications.
- Designed with hybrid silicone and nano-diamond particles for ultra-performance
- Non-curing and non-electrically conductive properties
- Conveniently included wipes and spreader
Nano-Diamond Particles for Superior Heat TransmissionUse of hybrid silicone and nano diamond micro particles ensures minimal thermal resistance for quick and efficient heat transmission.
Getting the most out of your processor, air and liquid heatsink cooler. Making it perfect for overclockers.
Easy and Safe ApplicationNon-curing paste means no time required to wait for curing process reaching its highest performance right from the get-go. Non-conductive properties ensures that there is no electrical risk with components.
Conveniently Included Wipes and SpreaderEasy application with included spreader to get an even coating on CPU or GPU for best efficiency. Wipes also included to clean old paste to make sure a good bond is established with heatsink.
ApplicationThermally conductive compound
Thermal Conductivity5.2 W/mK
Specific Gravity2.6
FormNon-curing compound
Operating Temperature-50øC to 250øC
Thermal Resistance0.04øC-cmý/W @ 60 psi
ColourGrey
Viscosity6,000,000 (mPa.s/ 22øC)
Weight5g
